发明名称 METHOD FOR OPTICALLY CURABLY MOLDING WITH IMPROVED STRAIN SUPPRESSING CAPACITY
摘要 PURPOSE:To suppress a strain of an optically curably molded form by scanning a thin layer of optically curable resin with an optical beam moving along a scanning line, inverting a scanning direction, and repeatedly scanning it. CONSTITUTION:A sectional layer 21 of optically curable resin is scanned by an optical beam moving along a scanning direction SLDD, and a sectional layer 22 is scanned by an optical beam moving along a scanning direction SLDU. Similarly, scanning directions of third, fifth,... sectional layers are SLDD, and fourth, sixth,... sectional layers are SLDU. Thus, the scanning directions are inverted at the sectional layers. In this manner, a stress tending to bend to the side of a surface S2 is operated at the first, third, fifth,... sectional layers, and a stress tending to bend to the side S1 is operated at the second, fourth, sixth,... sectional layers. As a result, an internal stress is cancelled as a whole to mold a molded form 20 having a small strain.
申请公布号 JPH06114949(A) 申请公布日期 1994.04.26
申请号 JP19920289653 申请日期 1992.10.01
申请人 SHIIMETSUTO KK 发明人 GI TAKASHI;HAYANO SEIJI
分类号 B29C35/08;B29C67/00;B29K105/24;G02B26/10;G03F7/20;G06F17/50;(IPC1-7):B29C67/00;G06F15/60 主分类号 B29C35/08
代理机构 代理人
主权项
地址