发明名称 TAPING STRUCTURE
摘要 PURPOSE:To provide a taping structure wherein, although spaces between the leads of a radial lead type electronic part are small, the leads can be mounted to a taping member with a constantly stable, high adhesive strength. CONSTITUTION:Of the three leads 2a, 2b and 2c to be mounted on a radial lead type electronic part 3, the central one 2b is made shorter than the other two and the end parts of these two leads 2a and 2c are fixed to the mount of a taping member 4 with a pressure-sensitive adhesive tape 6. Although spaces P between the three leads 2a, 2b and 2c are small, a space Q between the end parts of the two leads 2a and 2c thus mounted to the taping member 4 becomes larger. This lead mounting method provides a large adhesive area in the space Q between the pressure-sensitive adhesive tape 6 and the mount, whereby the leads 2a, 2b and 2c are mounted to the taping member 4 with ample adhesive strength.
申请公布号 JPH06115510(A) 申请公布日期 1994.04.26
申请号 JP19920262434 申请日期 1992.09.30
申请人 NEC KANSAI LTD 发明人 HIRAKI TSUTOMU
分类号 B65B15/02;B65B15/04;B65D73/02;H05K13/02 主分类号 B65B15/02
代理机构 代理人
主权项
地址