发明名称 Sputtering target and method of manufacture
摘要 A method for preparing a slurry target for use in a sputtering apparatus. The target material is ground into a powder form, and mixed with a solvent to form a slurry. The slurry is poured into a target mold and allowed to slow dry by evaporation at or near room temperature. The target is mechanically stable, can be positioned in any orientation without falling out of the mold, and resists failure from thermal stresses during sputtering.
申请公布号 US5306405(A) 申请公布日期 1994.04.26
申请号 US19920904997 申请日期 1992.06.26
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 LORENTZ, ROBERT D.;SEXTON, JOSEPH H.
分类号 C04B35/45;C04B35/622;C23C14/08;C23C14/34;(IPC1-7):C23C14/46;H01L39/24 主分类号 C04B35/45
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