发明名称 |
RETAINING MOLD FOR PRODUCING ELECTRONIC PART SEALING ELEMENT AND PRODUCTION OF ELECTRONIC PART SEALING ELEMENT USING THE SAME |
摘要 |
<p>PURPOSE:To obtain a retaining mold hard to deform at the time of the curing of a thermosetting resin sealing material and used many times as compared with a prior art one by forming the retaining mold for producing an electronic part sealing element from a thermoplastic norbornene resin. CONSTITUTION:A retaining mold 1 for producing an electronic part sealing element is formed from a thermoplastic norbornene resin and used in the molding of the seal part of the electronic part sealing element and, usually, a plurality of sealing injection parts are provided so as to be capable of obtaining a plurality of the electronic part sealing elements by one retaining mold 1. In the retaining mold 1 shown in a drawing, five sealing material injection parts 2 are arranged in one row but these injection parts 2 may be arranged in two or more rows. The sealing material is injection into the space of each of the sealing material injection parts 2 of the retaining mold 1 in such a state that an electronic part is arranged in each of the injection parts 2 so as not to come into contact with the inner wall thereof and cured to seal the electronic part.</p> |
申请公布号 |
JPH06114846(A) |
申请公布日期 |
1994.04.26 |
申请号 |
JP19920285103 |
申请日期 |
1992.09.30 |
申请人 |
NIPPON ZEON CO LTD |
发明人 |
KOUSHIMA YUUJI;OBARA TEIJI;NATSUUME YOSHIO |
分类号 |
B29C33/40;B29C35/02;B29C41/20;B29C45/02;B29C45/14;B29C45/26;B29C70/70;B29L31/34;C08G61/00;H01C17/02;H01G13/00;H01L21/56;(IPC1-7):B29C33/40 |
主分类号 |
B29C33/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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