发明名称 Radiation-sensitive compositions using novolak resins made from a substituted bis(hydroxyphenyl)methane and a bis-(methylol)-cresol
摘要 A novolak resin composition comprising at least one unit of the reaction product of a para-, para-bonded bisphenol having formula (A): (* CHEMICAL STRUCTURE *) (A) wherein R1=hydrogen, lower alkyl group having 1-4 carbon atoms, halogen, or lower alkoxy group having 1-4 carbon atoms; wherein R2=hydrogen or lower alkyl group having 1-4 carbon atoms; and wherein X is selected from the group consisting of: CH2, CH(CH3), C(CH3)2, O, and S; with a bismethylol monomer selected from a difunctional ortho-, ortho-phenolic bismethylol of Formula (B), a difunctional ortho-, para-phenolic bismethylol of Formula (C): (* CHEMICAL STRUCTURE *) (B) (* CHEMICAL STRUCTURE *) (C) wherein R3 is selected from CH3, CH2CH3, Cl, and Br; and wherein R4 is selected from H and CH3.
申请公布号 US5306594(A) 申请公布日期 1994.04.26
申请号 US19910787454 申请日期 1991.11.04
申请人 OCG MICROELECTRONIC MATERIALS, INC. 发明人 SARUBBI, THOMAS R.;SIZENSKY, JOSEPH J.
分类号 C08G8/08;G03F7/023;(IPC1-7):G03F7/023;G03F7/30 主分类号 C08G8/08
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