发明名称 BORING DEVICE FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE:To enhance the sensing accuracy of the amount of hole dislocation by photographing distinctly the part of boring without halation by the use of an X-ray filter which absorbs part of the X-ray energy. CONSTITUTION:A multi-layer base board 8 is placed on a work table 3, and an X-ray generator 4 is driven for a monitor 21 to photograph the mark provided on the base board 8, and on the basis of the obtained image information, the board 8 is located and the marked part thereon is bored with a drill 20. After boring, a cylinder 23 is actuated to allow an X-ray filter 7 to advance to the light path L for the X-rays given by the X-ray generator 4, and in this condition, the generator 4 is again driven for the monitor 21 to photograph the bored part of the board 8, and on the basis of this image information, the amount of hole dislocation on the board 8 can be sensed.
申请公布号 JPH06114695(A) 申请公布日期 1994.04.26
申请号 JP19920270194 申请日期 1992.10.08
申请人 SEIKOSHA CO LTD 发明人 MORINAGA SHINJI
分类号 B21D28/24;B23B41/00;B23Q17/24;B26F1/16;H05K3/00;H05K3/46;(IPC1-7):B23Q17/24 主分类号 B21D28/24
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