发明名称 |
Electroless bismuth plating bath |
摘要 |
In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60 degrees C. and a pH value of 8.6 to 8.8.
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申请公布号 |
US5306335(A) |
申请公布日期 |
1994.04.26 |
申请号 |
US19930013701 |
申请日期 |
1993.02.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SENDA, ATSUO;NAKAGAWA, TAKUJI;TAKANO, YOSHIHIKO |
分类号 |
C23C18/31;C23C18/52;(IPC1-7):C23C18/16 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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