| 发明名称 |
Resinless pseudoplastic bonding compositions |
| 摘要 |
An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.
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| 申请公布号 |
US5306333(A) |
申请公布日期 |
1994.04.26 |
| 申请号 |
US19930002308 |
申请日期 |
1993.01.08 |
| 申请人 |
QUANTUM MATERIALS, INC. |
发明人 |
DERSHEM, STEPHEN M. |
| 分类号 |
C03C8/18;H01L23/482;H01L23/498;(IPC1-7):C23C20/04 |
主分类号 |
C03C8/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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