发明名称 |
Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment |
摘要 |
A process for protecting aluminum nitride circuit substrates during electroless plating using surface oxidation. The aluminum nitride substrate is coated with a metal stack. The coating on the substrate is etched to form a circuit pattern. The patterned substrate is then fired in an oxidizing atmosphere at a temperature and time sufficient to convert the exposed aluminum nitride to aluminum oxide. After this conversion, the substrate is plated in an electroless solution forming a microwave circuit ready for component attachment and packaging.
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申请公布号 |
US5306389(A) |
申请公布日期 |
1994.04.26 |
申请号 |
US19910754864 |
申请日期 |
1991.09.04 |
申请人 |
OSRAM SYLVANIA INC. |
发明人 |
SMITH, SANDRA L.;HAZEN, BRIAN J. |
分类号 |
C23C8/02;C23C18/16;C23C18/18;H05K3/24;(IPC1-7):C23C26/00 |
主分类号 |
C23C8/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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