发明名称 Printed circuit board and terminal board with staggered conductive pads
摘要 A printed circuit board has a staggered array of mounting pads on a surface thereof for supporting a terminal board. A solder material is provided on the staggered array and then a terminal board having a corresponding array of pads is placed on the printed circuit board. The solder material is heated and then cooled, whereby the terminal board is fixed to the printed circuit board without causing an electric short between pads.
申请公布号 US5306541(A) 申请公布日期 1994.04.26
申请号 US19930005865 申请日期 1993.01.15
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KASATANI, YASUSHI
分类号 H05K1/11;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):B32B23/02 主分类号 H05K1/11
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