Method of direct transferring of electrically conductive elements into a substrate
摘要
A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.
申请公布号
US5305523(A)
申请公布日期
1994.04.26
申请号
US19920996445
申请日期
1992.12.24
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BROSS, ARTHUR;CEMPA, JULIAN G.;LUSSOW, ROBERT O.;MCDONALD, JAMES A.;MYERS, DONALD E.;PERUFFO, JOSEPH D.;WALSH, THOMAS J.;WALSH, III, THOMAS J.