发明名称 PACKAGE FOR HIGH FREQUENCY ELEMENT
摘要 PURPOSE:To provide a package for a high frequency element which can prevent parasitic resonance microstrip resonance, etc., from occurring in a signal line and the transmission loss of a signal line from increasing, in the case of having transmitted a high frequency signal to a signal line equipped with a ceramic frame, which is structurized into a microstrip line or a strip line with grand layers equipped above and below the signal line. CONSTITUTION:The frames on both sides of a DC line 30 are provided with vias 400, which connect the grand layers 40 and 42 above and below a signal line 10 with each other, and also a plurality of ground vias 500 are arranged side by side closely to the signal line 10. And, the lateral width of the pseudo rectangular coaxial wall of the signal line 10 which is of pseudo rectangular coaxial structure, being surrounded by the pseudo ground wall 502 consisting of a plurality of ground vias 500 and the ground layers 40 and 42.
申请公布号 JPH06112352(A) 申请公布日期 1994.04.22
申请号 JP19920283826 申请日期 1992.09.29
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIYAMOTO TAKAHARU;MIYAGAWA FUMIO;ICHIKAWA KEIICHI
分类号 H01L23/12;H01P1/00;H01P3/08 主分类号 H01L23/12
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