发明名称 BONDING WIRE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To lower the incidence of an A-point exfoliation in a high-temperature shelf test by a method wherein the strength of an Au wire is enhanced by adding Pt and its addition amount is set at a proper range. CONSTITUTION:High-purity-Pt at 0.1 to 1wt.% is added to high-purity Au, at least one kind out of Fe, Si, Be, Ca, Ge, Y, Sc and rare-earth elements is added to it at 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed suffiently. Thereby, a bus having a wire diameter of 25mum is formed.
申请公布号 JPH06112254(A) 申请公布日期 1994.04.22
申请号 JP19920262217 申请日期 1992.09.30
申请人 TANAKA DENSHI KOGYO KK 发明人 ITABASHI KAZUMITSU;KUJIRAOKA TAKESHI
分类号 H01L21/60;C22C5/02 主分类号 H01L21/60
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