| 摘要 |
PURPOSE:To form a bump electrode of smaller diameter at a lower cost on an electrode pad of semiconductor substrates, etc. CONSTITUTION:A photoresist film 4 is formed, so as to at least cover the portion of an electrode pad 2, on a semiconductor substrate 1, etc., then after a through hole 5 is opened at the portion of the electrode pad 2 of the photoresist film 4 by photo-etching, the through hole 5 is filled with a metal paste 7. Further, it is heated to a specified temperature for baking, and then removed. |
