| 摘要 |
<p>PURPOSE:To secure the wettability of the title electronic part to a solder during packaging step for decreasing defective markings in the marking step while shortening the assembling process time. CONSTITUTION:The title method of forming electronic part is composed of the four steps enumerated as follows, i.e., the first step of preparing the assembling parts such as a passive element 6, a sealing element 1, an inner lead 2A, etc., as well as preparing an outer lead 2B formed of a metallic plating layer 5 harder than solder and having the wettability to the solder on the circumferential surface independently of and in parallel with the former preparing step, the second step of junctioning one end side of the inner lead 2A with one end side of outer lead 2B, the third step of electrically connecting the passive element 6 to the other end side of the inner lead 2A to be sealed with a cylindrical sealing element 1 and the fourth step of marking on the circumferential surface of sealing element 1 being rotated. On the other hand, the metallic plating layer 5 is formed of an Ni film or a Cr film.</p> |
