| 摘要 |
PURPOSE:To lower the incidence of an A-point exfoliation in a high-temeprature shelf test by a method wherein the strength of an Au wire is enhanced by adding Pd and its addition amount is set at a proper range. CONSTITUTION:High-purity Pd at 0.01 to 1wt.% is added to high-purity Au, at least one kind out of Fe, Si, Be, Ca, Ge, Y, Sc and rare-earth elements is added to it at 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed sufficiently. Lastly, a bus having a wire diameter of 25mum is molded. |
