| 摘要 |
PURPOSE:To easily control an abrasion amount by using a stopper whose selection ratio between an abraded object and abrasion is large and which can be used irrespective of types of abrasives. CONSTITUTION:A method for fabricating a semiconductor device for abrading layer 3, 6 to be machined which have been formed on a semiconductor substrate 1 comprises a process (b) for forming a carbon film as stopper for abrasion before a process (h) for abrading a layer 6 to be machined. |
