发明名称 BONDING WIRE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To lower the incidence of an A-point exfoliation in a high-temperature shelf test by a method wherein the strength of an Au wire is enhanced by adding a Pt group element and its addition amount is set at a proper range. CONSTITUTION:One kind or two or more kinds out of Pd, Pt, Rh, Ir, Os and Ru are added to high-purity Au at a total addition amount of 0.1 to 5wt.%, and one kind or two or more kinds out of Ca, Be, Ge, Si, Fe, Y and rare-earth elements are added to it at a total addition amount of 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is molded.
申请公布号 JPH06112251(A) 申请公布日期 1994.04.22
申请号 JP19920262211 申请日期 1992.09.30
申请人 TANAKA DENSHI KOGYO KK 发明人 ITABASHI KAZUMITSU;KUJIRAOKA TAKESHI
分类号 H01L21/60 主分类号 H01L21/60
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