发明名称 LEAD FRAME
摘要 PURPOSE:To obtain the title lead frame causing no cracking at all even in reflow time by a method wherein flame coating films in specific thickness is formed on the front surface and the rear surface of a die pad to enhance the bond properties onto a mold resin. CONSTITUTION:Flame coating films 4a, 4b comprising aluminum (Al) or aluminum oxide (Al2O3) or silicon oxide (SiO2) in thickness of 1-3mum are formed on the front surface and the rear surface of a die pad 3 encircled by lead 2. Within the flame coating films 4a, 4b, molten particles jetted from a nozzle adhere to the surface of a die pad to be coagulated thereon furthermore, a coated layer is formed by the molten particles coated on the coagulated particles. At this time, cavities are formed between the fixed particles to make the whole film surface porous. Accordingly, the surface area is increased to enhance the bond properties onto the mold resin. Furthermore, due to the formation of the flame coating films 4a, 4b comprising the homogeneous material, the die pad is not to be deformed thereby enabling a stable resin mold 7 to be obtained.
申请公布号 JPH06112390(A) 申请公布日期 1994.04.22
申请号 JP19920254977 申请日期 1992.09.24
申请人 NIPPON STEEL CORP 发明人 OKIKAWA SUSUMU;KITAGUCHI SABURO;SHIMODA NOBUYUKI
分类号 C23C4/10;H01L21/316;H01L23/28;H01L23/50 主分类号 C23C4/10
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