| 摘要 |
PURPOSE:To provide a Pt-alloy extrafine wire, for semiconductor element use, wherein it enhances the high-temperature strength of a Pt extrafine wire, it lowers the incidence of an A-point exfoliation in a high-temperature shelf test and it is extremely useful for a wire bonding method and a bump connecting method. CONSTITUTION:One kind or two kinds out of Au and Pd are added to high- purity Pt at a total addition amount of 0.01 to 10wt.%, one kind or two kinds out of Ru and Rh are added to it at 0.01 to 1wt.%, one kind or two or more kinds out of Be, Ge, Ca, Si, Fe, So, Y and rare-earth elements at 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is molded. |
