| 摘要 |
PURPOSE:To provide a semiconductor device, wherein a mounting of an integrated circuit to a multipin-constructed, pitch-narrowed and high-precision formed lead frame can be easily conducted and which is capable of improving a heat dissipation property and is high also in reliability. CONSTITUTION:An islandless semiconductor device is one of a structure, wherein an Al substrate 4, which has no island and has the surface subjected to dielectric treatment, is arranged in the vicinity of the center of said semiconductor device and a relay electrode 3 consisting of a conductive paste is provided on the substrate, and an electrical connection in the device is made in such a way that the connection between said electrode 3 and the integrated circuit is made by a connection 6 using a bump and the electrode 3 and inner leads are connected to each other by a plated film formed by electroplating. |
