| 摘要 |
PURPOSE:To provide a semiconductor device where flip chips are easily mounted high in density and a mounting method thereof. CONSTITUTION:First bumps 5 and second bumps 6 smaller than the first bumps 5 in size but higher in melting point are provided between an IC chip 2 and a first bump 5. First of all, a self-alignment process is carried out when the first bumps 5 are formed by fusing, and then the IC chip 2 and the board 1 are very precisely positioned and connected. Then, the IC chip 2 and the board 1 are connected high in density with the second bumps 6. |
