| 摘要 |
PURPOSE:To surely perform a bonding operation without causing a defect in a bonding pad for a semiconductor device whose density is high regarding a wire bonding apparatus which bonds a wire to the semiconductor device or the like. CONSTITUTION:A capillary control means 6 moves and controls a capillary 2 to a direction nearly parallel to the face of a stage 5 according to coordinates of a connecting face 3 which has been input in advance, and brings a wire 1 into pressure contact with the connecting face 3. A light-receiving part 8 receives reflected light from the connecting face 3 of light applied from a light- emitting part 7. A stage control means 9 controls the inclination of the stage 5 in such a way that the connecting face 3 becomes an optimum direction with reference to the capillary 2 on the basis of the light-receiving amount of the light-receiving part 8. |
