发明名称 |
FORMATION METHOD OF ELECTRIC CONNECTION BODY OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PROVIDED WITH ELECTRIC CONNECTION BODY FORMED BY SAID METHOD |
摘要 |
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申请公布号 |
JPH06112197(A) |
申请公布日期 |
1994.04.22 |
申请号 |
JP19930204434 |
申请日期 |
1993.07.28 |
申请人 |
MICRON TECHNOL INC |
发明人 |
CHIYAARUSU EICHI DENISON;TORANGU TEII DOON |
分类号 |
H01L21/28;H01L21/285;H01L21/306;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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