| 摘要 |
PURPOSE:To provide a bonding wire, for semiconductor element use, wherein it enhances the strength of an Au wire by adding Pd, Pt, Rh, Ir, Os and Ru, it lowers the incidence of an A-point exfoliation in a high-temperature shelf test and it is extremely useful for a wire bonding method and a bump connecting method. CONSTITUTION:At least one kind out of Pd, Pt, Rh, Ir, Os and Ru is added to high-purity Au at 0.0003 to 0.1wt.%, at least one kind out of Sc, Y and rare- earth elements is added to it at 0.0001 to 0.005wt.%, one or more kinds out of Be, Ca, Ge, Ni, Fe, Co and Ag are added to it at 0.0001 to 0.05wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed, and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is formed. |
