发明名称 SEALING STRUCTURE OF ELECTRONIC PART
摘要 <p>PURPOSE:To provide the sealing structure of an electronic part which can lessen the dispersion of the characteristics of an electronic part, and can be assembled simply. CONSTITUTION:An electronic part 14 is mounted on one surface 10a of a wiring board 10, and a conductor pattern 23a, to which the terminal 15 of the electronic part 14 is connected, is led out to the other surface 10b by the wiring board 10 consisting of multilayer wiring boards 20 and 21. The trimming resistor 25 of the electronic part 14 is connected to the conductor pattern 13b led out to the other surface 10b of the wiring board 10. Moreover, on one surface 10a of the wiring board 10 is a cover 16 put airtightly so as to cover the mounted electronic, part 14. Accordingly, even after the sealing of the electronic part 14, the characteristics of offsetting, etc., which has occurred in the manufacture process, can be adjusted by the trimming resistance 25, and the yield can be improved by suppressing the dispersion of the property.</p>
申请公布号 JPH06112661(A) 申请公布日期 1994.04.22
申请号 JP19920256743 申请日期 1992.09.25
申请人 FUJITSU TEN LTD 发明人 YAMANO SHINICHI
分类号 G01P15/00;G01P15/08;H05K3/28;H05K5/00;(IPC1-7):H05K5/00 主分类号 G01P15/00
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