| 摘要 |
PURPOSE:To carry out bonding large in connection strength, small in junction- occupied area and free in directional constraint by connecting a disc unit formed concentrically through opening one end of a bonding wire perpendicularly to an electrode of a semiconductor element. CONSTITUTION:An aluminum sphere 13a is formed by fusing an end of a bonding wire 13 projecting from a capillary 4 with an electric torch device in nonoxidative inert gas atmosphere coming out of an inert gas injection nozzle 5. Next, the capillary 4 is pressed onto an electrode metallic layer 2 of a semiconductor element 1, and an ultrasonic wave is impressed to joint the bonding wire 13 perpendicularly to the electrode face at the sphere 13a. Since there is no directional constraint for bonding, the constraint of backing can be eliminated regardless of the electrode being arranged radially or obliquely.
|
