Metalldose zum Unterbringen eines IC und dazugehöriges Herstellungsverfahren.

摘要

A metal case for housing electronic parts including an IC and a manufacturing method therefor are disclosed. The case comprises a shallow vessel having a wall on its periphery which is formed from metal sheet having the same thickness as the bottom of said depression and a rectangular metal ring which has a contour such that it can fit into the wall of said shallow vessel, said rectangular metal ring being fit into said shallow vessel and connected thereto so as to form a single body.