发明名称 Parts installation structure and method of manufacturing parts installation structure.
摘要 <p>A present invention is to provide a thin parts installation structure and their manufacturing method. This is formed a circuit (11) on the wiring substrate (1), the adhesive (3) is deposited on the part installation scheduled position of the said wiring substrate (1), the conductive adhesive (4) is deposited on the terminal areas of the wiring pattern circuits, the electronic part (2) is put on the scheduled part of wiring substrate (1) and touching the terminals (21) of the electronic part (2) to said conductive adhesive (4) while not making these adhesive (3) and conductive adhesive (4) solid, then said adhesive (3) and conductive adhesive (4) are stiffened. <IMAGE></p>
申请公布号 EP0593155(A1) 申请公布日期 1994.04.20
申请号 EP19930306479 申请日期 1993.08.17
申请人 MINEBEA CO.,LTD. 发明人 SHIOTA, NAOHIRO;OBARA, RIKURO
分类号 H05K1/00;H05K1/18;H05K3/00;H05K3/28;H05K3/30;H05K3/32;(IPC1-7):H05K3/30 主分类号 H05K1/00
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