发明名称 Polyamide composition and the use.
摘要 <p>Polyamide composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.</p>
申请公布号 EP0592941(A2) 申请公布日期 1994.04.20
申请号 EP19930116209 申请日期 1993.10.07
申请人 KISHIMOTO SANGYO CO., LTD. 发明人 MORIWAKI, TAKESHI, KISHIMOTO SANGYO CO., LTD.
分类号 C08L61/06;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08L61/06
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