| 摘要 |
<p>A connector contact is described, of the type that has a platform (50, Figure 2) which holds a circuit component (52) and a grounding conductor (54), which provides hermetic sealing of the component. The circuit component has bottom and top terminals (70, 72, Figure 5) each joined by a coupling layer (74, 76) of high surface energy material such as solder, respectively to the platform and to a finger (60) of the grounding conductor. Each coupling layer overhangs the circuit component to leave a surrounding layer portion (80, 82). An encapsulant includes a moisture-proof inner portion (90) which surrounds the component and which extends between and bonds to the surrounding portions (80, 82) of the lower and upper coupling layers. <IMAGE> <IMAGE></p> |
