发明名称 MANUFACTURE OF COPPER-CLAD LAMINATE
摘要 <p>PURPOSE:To provide a method for manufacturing a copper-clad laminate where dimensional change and dispersion at processing a circuit are slight. CONSTITUTION:A copper-clad laminate can be obtained by superposing a copper foil on a plurality of prepregs obtained by making base materials such as glass woven fabric and glass un-woven fabric impregnated with resin, and pressurizing it with heat. The obtained copper-clad laminate is vibrated and further heated. The heating temperature is made to be above glass transition temperature of the using resin and below molding temperature +20 deg.C. It is desirable to give vibration also during cooling process.</p>
申请公布号 JPH06106645(A) 申请公布日期 1994.04.19
申请号 JP19920261449 申请日期 1992.09.30
申请人 HITACHI CHEM CO LTD 发明人 SHIMIZU HIROSHI
分类号 B29C71/00;B29C43/02;B29C71/02;B29K105/06;B32B15/08;B32B17/04;B32B37/00;H05K3/00;(IPC1-7):B29D9/00;B32B31/16 主分类号 B29C71/00
代理机构 代理人
主权项
地址