HANDLING METHOD FOR PLATE MATERIAL

摘要

PURPOSE:To provide a handling method for plate material capable of automatically and efficiently peeling a plate material from an adhesive tape without damaging it. CONSTITUTION:A number of plate materials (a) neatly arranged and held adjacent to each other in the upright state on an adhesive tape (b) are moved in the arranged direction. The movement is stopped when the top plate material (a) reaches a fixed position, both sides of the plate material (a) is held by a pair of chucks 1, 1, the plate material (a) is inclined forward in the held state and successively raised in the inclined direction to peel the plate material from the adhesive tape (b), and this operation is repeated.