发明名称 |
Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process |
摘要 |
A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of a resin, by introducing a molding compound sheet 20 into the cavities 33 of molds 31, 32 before the molds are clamped, by melting the molding compound sheet 20 in the cavities 33 into a liquid molding material 45 after the mold clamping action to pressure fill up the inside of the cavities 33, and by setting the liquid molding material 45 integrally.
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申请公布号 |
US5304512(A) |
申请公布日期 |
1994.04.19 |
申请号 |
US19920994888 |
申请日期 |
1992.12.22 |
申请人 |
HITACHI, LTD. |
发明人 |
ARAI, KATSUO;OKADA, SUMIO;OOBA, TAKASHI;TAKAHASHI, KAZUYA;KANEKO, MAYUMI |
分类号 |
H01L21/56;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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