| 摘要 |
In forming a diamond film on a surface of substrate by means of plasma method, there is employed in a plasma reacting chamber a supporting member having a top surface for placing the substrate so disposed as to be smaller than a bottom surface of the substrate and having engagement means for engaging with the substrate. When the substrate (particularly substrate for a cutting tool) placed on the top surface of the supporting member is brought into contact with plasma obtainable by exciting raw material gases, a diamond film is coated on the face, land and flank of the substrate for the cutting tool with a uniform film thickness.
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