| 摘要 |
A liquid heat sink is provided that employs natural convection of a liquid coolant (18') to cool a printed circuit board (14) on which are mounted a plurality of heat-generating components (12). In particular, the spacing d between the heat-generating components and a cold plate (20) used to cool the liquid must be such as to provide a Rayleigh number of at least about 1700 in the Rayleigh equation: (* CHEMICAL STRUCTURE *) In the above equation, g is the acceleration of gravity, (beta) is the volumetric coefficient of expansion of the liquid coolant, T1 is the temperature of the cold plate, T2 is the temperature of the component to be cooled, (ny) is the kinematic viscosity of the liquid coolant, and (alpha) is the thermal diffusivity of the liquid coolant. The novel heat sink of the present invention allows complete immersion of the component in the liquid to provide maximum heat transfer, while at the same time providing a mounting/packaging scheme that allows full utilization of the desired heat transfer properties.
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