发明名称 |
Power carrier with selective thermal performance |
摘要 |
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.
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申请公布号 |
US5305186(A) |
申请公布日期 |
1994.04.19 |
申请号 |
US19930009958 |
申请日期 |
1993.01.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
APPELT, BERND K.;MEMIS, IRV;SCHUMACHER, RICHARD A.;LAUFFER, JOHN M. |
分类号 |
H01L23/12;H01L23/36;H01L23/367;H01L25/07;H01L25/18;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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