| 摘要 |
The package comprises two PCBs attached to each other, dipads for mounting a semiconductor chip on them, bonding pads formed on the semiconductor chip, wires for connecting the bonding pad with the PCB, dams for placing the chip and the pad, a protecting material filling the inside of the dams, contact pins installed on the peripherals of the PCBs, and inserting terminals connected to the contact pins.
|
