SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To increase the manufacturing yield of and reliability upon an LSI package using a compound lead frame. CONSTITUTION:An insulating substrate 3a for mounting a semiconductor chip is arranged on the central part of a lead frame. Many conductor wirings 5 are formed around a chip mounting region 4 on the main surface of the insulating substrate 3a. On the other hand, multiple leads 6 are arranged outside the insulating substrate 3a and one ends of respective leads 6 are extended to the parts near the insulating substrate 3a. Furthermore, one-sided ends of suspended leads 7 are junctioned with the four corners of the insulating substrate 3a to be supported and fixed by these four suspended leads 7.