| 摘要 |
PURPOSE:To prevent the occurrence of cracks in a ceramic chip part or solder by forming a soldering lead by bending part of an electrode outwardly thereby giving spring characteristics to the electrode and absorbing mechanical stresses applied to jointed solder by the electrode having the spring characteristics. CONSTITUTION:In a ceramic chip part comprising a construction having a ceramic 1 and metal electrodes 6 covering both the ends of the ceramic 1, part of the electrode 6 is bent outwardly thereby forming a soldering lead 2. Then, if the temperature of an aluminum substrate 5 rises, the aluminum substrate 5 is deformed more than the ceramic chip part because the coefficient of linear expansion of the aluminum substrate 5 is higher than that of the ceramic chip part, so that mechanical stresses are applied to a solder part 3 which joints the ceramic chip part to the aluminum substrate 5 but the mechanical stresses can be absorbed by the deformation of the soldering lead 2, thereby preventing the occurrence of cracks in solder connecting the ceramic chip part to the aluminum substrate.
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