| 摘要 |
<p>PURPOSE:To scribe without being affected by the dispersion in the thickness of a substrate by measuring the substrate thickness, automatically setting a cutter height corresponding to the measured value and always setting the cutter height to an optimum value. CONSTITUTION:This device is a scribing device provided with a substrate thickness measuring sensor 4 and a control part 10. and drawing a scribing line for cutting on the substrate 2 on a stage using a cutter, and by the substrate thickness measuring sensor 4, the thickness of the substrate 2 on the stage is measured, and by the control part 10, a distance from the stage 3 to the edge of the cutter is adjusted corresponding to the substrate thickness. Then, before the substrate 2 is scribed by the cutter 1, the substrate thickness measuring sensor 4 is abuttd on the substrate at the central part of the substrate, and the substrate thickness is measured. The height 5 of the cutter 1 is adjusted by the control part 10 corresponding to the measured value, and scribing is started. Thus, the cutter height 5 is set to the optimum value always corresponding to the dispersion in the thickness of the substrate, and the depth of cutting by the scribing becomes constant.</p> |
