| 摘要 |
PURPOSE:To provide a multilayer wiring board, and production method thereof, in which high density wiring is realized through simple production process while incorporating a capacitor having high capacity. CONSTITUTION:A first ground layer 10 having potential of 0V, a first dielectric layer 3 having high dielectric constant, a power supply layer 11 to be applied with a DC voltage for driving an IC, a second dielectric layer 4, a second ground layer 12 connected with the first ground layer 10, a first low dielectric layer 5 having low dielectric constant, a first signal wiring layer 13, a second low dielectric layer 6, a second signal wiring layer 14, and a third low dielectric layer 7 are laminated sequentially on a multilayer wiring board 1. A die attach 16 and pads 15 are also formed on the surface of the board 1. |
