RESIN TABLET FOR SEALING SEMICONDUCTOR, ITS MANUFACTURE, AND SEMICONDUCTOR SEALING METHOD

摘要

PURPOSE:To smoothly seal a semiconductor chip without causing any resin jamming at a gate by specifying the gelled particle content of a tablet within a specific particle size distribution range. CONSTITUTION:This tablet is manufactured by cooling and solidifying the molten body of a resin composition containing a curing agent. The gelled particle content of the table is specified in such a way that the contains 0% of +60-mesh fraction and <=10ppm of +100-mesh fraction. By utilizing a rotation of the screw of a kneading and extruding machine 1, the resin composition in the hopper of the machine 1 is fed to the heating cylinder 11 of the machine 1 so as to charge a tablet molding die 4 with the resin composition through a resin feeding passage member 2 by the extruding force of the screw. Therefore, sealing of a semiconductor chip by transfer molding can be performed smoothly even with an extremely narrow gate.