| 摘要 |
PURPOSE:To improve the receiving photosensitivity without reducing the yield or the like, by handling a plurality of photodetectors with one signal processing IC. CONSTITUTION:A pin photodiode section 1 having twenty-two pin photodiode bare chips 1a connected in parallel and one IC section 2 are formed. The IC section 2 comprises an auto-bias level controller 3, a head amplifier 4, a limiter amplifier 5, a BPF 6, detector and comparator 7, an integrator 8, and a hysteresis comparator 9. Further, a chip part mounting section 10 is formed. Then, the twenty-two pin photodiode bare chips 1a, that is, photodetectors are transversely arranged and the one signal processing IC section 2 is integrated. Thus, a photodetector having a high directivity can be obtained and a detection of a high-speed transfer body can be performed. |
