SOLDERING OF HYBRID IC,申请号JP19920093614-传众专利搜索

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发明名称	SOLDERING OF HYBRID IC
摘要
申请公布号	JPH06104295(A)	申请公布日期	1994.04.15
申请号	JP19920093614	申请日期	1992.03.19
申请人	TAMURA SEISAKUSHO CO LTD	发明人	TAKADA TOMIYASU;HASHIGUCHI YUSAKU
分类号	H01L21/52;H01L25/04;H01L25/18;(IPC1-7):H01L21/52	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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