发明名称 FORMATION OF CONDUCTOR PATTERN
摘要 PURPOSE:To provide a method for forming a conductor pattern on a multilayer ceramic board being employed in the constitution of circuit for various electronic appliances in which strength of conductor pattern printed on the surface of green sheet is increased while preventing open circuit or short circuit of inner layer pattern in a laminated and burnt ceramic board. CONSTITUTION:A conductor pattern 2 of copper paste is formed through screen printing onto the surface of a green sheet 1 and dried at 70 deg.C. It is then mounted on a supporting board 14 slightly larger than the green sheet 1 and placed in a thin containing bag 15 made of synthetic resin while being sealed hermetically. The containing bar 15 is then evacuated and atmospheric pressure is applied uniformly onto the entire surface of the conductor pattern 2 or hydrostatic pressure is applied externally through a synthetic rubber onto the entire surface of the conductor pattern 2 uniformly.
申请公布号 JPH06104552(A) 申请公布日期 1994.04.15
申请号 JP19920249754 申请日期 1992.09.18
申请人 FUJITSU LTD 发明人 YOKOYAMA HIROZO
分类号 H05K3/12;H05K3/46;(IPC1-7):H05K3/12 主分类号 H05K3/12
代理机构 代理人
主权项
地址