| 摘要 |
The invention relates to the encapsulation of integrated circuits, and their encapsulation in a multilayer ceramic package in particular. In order to place variable-sized chips on a monolithic chip (22, 24, 26) reception site (23, 25, 27), without the connecting wires between the chip and the conductive gaps (44) which surround the chosen site being too long, the invention provides for covering the chip reception site with many conductive pads which are insulated from one another and can act as weld relays for said connecting wires (80, 90, 100). If the chip is large (chip 24) it is stuck or welded onto said pads; if it is small (chip 22), it is surrounded by pad-relays. |
