| 摘要 |
PURPOSE:To coat only a metal wiring area with solution in regard to a laser processing apparatus to form a metal wiring by irradiating a coated film on a substrate with laser beam. CONSTITUTION:Under the condition that positional arrangement is made so that a solution injector 4 injects a conductive paste to the point P, the conductive paste 22 is injected from a solution injecting port 5a and simultaneously an XYZ stage is started to move in the direction of arrow mark 30 as shown in figure (E). When the point P moves in the arrow mark direction and reaches on the light axis 18, the conductive paste 22 is irradiated with a laser beam 23. The conductive paste 22 reacts through absorption of light to form a metal film consisting of crystallized gold. As shown in figure (F), a metal film 24 is formed by continuous application of the laser beam 23 to the conductive paste 22. When the conductive paste 22 is injected to the point Q, injection of the conductive paste 22 is stopped and the irradiation of the conductive paste 22 is also stoppted when the point Q has reached the focusing point of the laser beam. |
