Arrangement for metal concentration stabilisation in copper@ plating cylinders - by use of an auxiliary anode in addition to main copper@ anode

摘要

In the plating of low pressure cylinder or rotary, bodies with Cu, an insoluble anode (3) of e.g. platinised expanded metal, dimensioned according to cylinder size, is positioned between the cathodic cylinder (1) and the anode (6), supplied by an auxiliary circuit (4). Metal ion discharge takes place at the cylinder by electrolysis with the Cu chips in the anode basket and directly from the electrolyte soln. by interpolation of the auxiliary anode. ADVANTAGE - Stabilises metal concn. in the acid Cu electrolyte. Furthermore, metal ion discharge from the copper sulphate solution into the electrolytic bath is activated.