| 摘要 |
A method of selectively machining a component such as a printed circuit board which comprises a first material 2 (copper) and a second material 3 (insulating substrate) comprises the steps of: using a single laser 1 having first and second emission wavelengths to selectively irradiate the component with a pulsed laser beam of the first wavelength at an energy fluence sufficient to cause ablation of the first material but insufficient to cause appreciable ablation of the second material; and selectively irradiating the component with a pulsed laser beam of the second wavelength at an energy fluence sufficient to cause ablation of at least the second material, whereby holes and slots may be cut in the component by simultaneous or successive irradiation by the two wavelengths. The apparatus for carrying out this method employs a laser 1 switchable between different wavelengths and a control means to coordinate the laser with the workpiece. <IMAGE> |
